ICT-2007.3.1
ICT-2007.3.1
20 projects · €86,287,747 total EU contribution (project-level) · 158 participating organizations · 22 countries with participants
Total EU funding
Sum of EC max contribution fields for distinct projects in this topic.
€86,287,747
Countries active
Participant organizations by country (headquarters in CORDIS).
- Germany (37)
- France (27)
- Italy (16)
- UK (12)
- BE (11)
- AT (10)
- Netherlands (9)
- FI (7)
- CH (4)
- Spain (4)
- HU (3)
- IE (3)
- SE (3)
- DK (2)
- IL (2)
- PL (2)
- AM (1)
- CZ (1)
- EL (1)
- PT (1)
- SK (1)
- ZA (1)
Open calls
From the EU Funding & Tenders Portal, linked to this topic code when it matches the call identifier. Sync via yarn etl:funding.
No open or forthcoming calls linked to this topic in the database yet.
Top organizations
By number of distinct projects in this topic.
- CEA10 projects · FR
- IMEC9 projects · BE
- CNRS6 projects · FR
- Fraunhofer6 projects · DE
- STM CROLLES5 projects · FR
- CHALMERS TEKNISKA HOGSKOLA AB4 projects · SE
- KU Leuven4 projects · BE
- IFAG3 projects · DE
- NCSR ""D""""3 projects · EL
- MIY3 projects · IT
- QIMONDA DRESDEN3 projects · DE
- UCC3 projects · IE
Projects
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| Project | Programme | EU contribution | Total cost | |
|---|---|---|---|---|
Towards 0.5 Terahertz Silicon/Germanium Heterojunction Bipolar Technology DOTFIVE · 216110 | FP7 | €9,699,969 | €14,740,480 | Details |
EUROPRACTICE CAD and IC service for European universities and research institutes EUROPRACTICE IC4 · 214157 | FP7 | €3,150,000 | €4,821,082 | Details |
Gigascale Oriented Solid State flAsh Memory for EuRope GOSSAMER · 214431 | FP7 | €13,098,830 | €20,811,603 | Details |
Dual-channel CMOS for (sub)-22 nm high performance logic DUALLOGIC · 214579 | FP7 | €5,799,338 | €9,000,009 | Details |
Reliable and Variability tolerant System-on-a-chip Design in More-Moore Technologies REALITY · 216537 | FP7 | €2,899,883 | €4,447,211 | Details |
Automotive Tested High-voltage Embedded Non-volatile memory Integrated SoC ATHENIS · 216436 | FP7 | €5,150,000 | €8,084,966 | Details |
Silicon-based nanostructures and nanodevices for long term nanoelectronics applications NANOSIL · 216171 | FP7 | €4,300,000 | €5,456,404 | Details |
Copper Interconnects for Advanced Performance and Reliability CopPeR · 216474 | FP7 | €3,150,000 | €4,692,486 | Details |
Extended Large (3D) Integration TEchnology ELITE · 215030 | FP7 | €3,600,000 | €5,628,834 | Details |
Material Development for Double exposure and Double patterning MD3 · 214948 | FP7 | €3,092,423 | €4,684,221 | Details |