ICT-2007.3.1
ICT-2007.3.1
20 projects · €86,287,747 total EU contribution (project-level) · 158 participating organizations · 22 countries with participants
Total EU funding
Sum of EC max contribution fields for distinct projects in this topic.
€86,287,747
Countries active
Participant organizations by country (headquarters in CORDIS).
- Germany (37)
- France (27)
- Italy (16)
- UK (12)
- BE (11)
- AT (10)
- Netherlands (9)
- FI (7)
- CH (4)
- Spain (4)
- HU (3)
- IE (3)
- SE (3)
- DK (2)
- IL (2)
- PL (2)
- AM (1)
- CZ (1)
- EL (1)
- PT (1)
- SK (1)
- ZA (1)
Open calls
From the EU Funding & Tenders Portal, linked to this topic code when it matches the call identifier. Sync via yarn etl:funding.
No open or forthcoming calls linked to this topic in the database yet.
Top organizations
By number of distinct projects in this topic.
- CEA10 projects · FR
- IMEC9 projects · BE
- CNRS6 projects · FR
- Fraunhofer6 projects · DE
- STM CROLLES5 projects · FR
- CHALMERS TEKNISKA HOGSKOLA AB4 projects · SE
- KU Leuven4 projects · BE
- IFAG3 projects · DE
- NCSR ""D""""3 projects · EL
- MIY3 projects · IT
- QIMONDA DRESDEN3 projects · DE
- UCC3 projects · IE
Projects
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| Project | Programme | EU contribution | Total cost | |
|---|---|---|---|---|
Investigation of Si wafer damage in manufacturing processes SIDAM · 216382 | FP7 | €2,049,997 | €2,647,698 | Details |
Wavelength Division Multiplexed Photonic Layer on CMOS WADIMOS · 216405 | FP7 | €2,299,982 | €3,115,657 | Details |
Provision of a European training infrastructure EuroTraining · 211806 | FP7 | €1,398,009 | €1,398,009 | Details |
MAsk less lithoGraphy for IC manufacturing (MAGIC) MAGIC · 214945 | FP7 | €11,749,999 | €16,694,010 | Details |
European platform for low-power applications on Silicon-on-Insulator Technology EUROSOI+ · 216373 | FP7 | €800,000 | €870,602 | Details |
Shrink-Path of Ultra-Low Power Superconducting Electronics S-PULSE · 215297 | FP7 | €550,000 | €584,316 | Details |
MOdelling and CHAracterization for SiP Signal and Power Integrity Analysis MOCHA · 216732 | FP7 | €1,849,337 | €3,209,639 | Details |
Integrated Circuit/EM Simulation and design Technologies for Advanced Radio Systems-on-chip ICESTARS · 214911 | FP7 | €2,800,000 | €4,077,063 | Details |
Implementation of widespread IC design skills in advanced deep submicron technologies at European Academia IDESA · 215180 | FP7 | €1,450,000 | €1,954,351 | Details |
Nano Packaging Technology for Interconnect and Heat Dissipation NANOPACK · 216176 | FP7 | €7,399,980 | €11,201,517 | Details |