ICT-30-2017
ICT-30-2017
17 projects · €90,605,165 total EU contribution (project-level) · 164 participating organizations · 24 countries with participants
Total EU funding
Sum of EC max contribution fields for distinct projects in this topic.
€90,605,165
Countries active
Participant organizations by country (headquarters in CORDIS).
- France (25)
- Germany (22)
- Italy (18)
- Spain (14)
- Netherlands (13)
- CH (11)
- UK (10)
- BE (6)
- FI (6)
- PL (6)
- EL (5)
- SE (5)
- AT (4)
- IL (4)
- IE (3)
- DK (2)
- KR (2)
- PT (2)
- BG (1)
- CZ (1)
- HU (1)
- JP (1)
- LT (1)
- NO (1)
Open calls
From the EU Funding & Tenders Portal, linked to this topic code when it matches the call identifier. Sync via yarn etl:funding.
No open or forthcoming calls linked to this topic in the database yet.
Top organizations
By number of distinct projects in this topic.
- Fraunhofer6 projects · DE
- IMEC5 projects · BE
- UCC5 projects · IE
- TU/e4 projects · NL
- ARISTOTLE UNIVERSITY OF THESSALONIKI3 projects · EL
- CNRS3 projects · FR
- CEA3 projects · FR
- CNR3 projects · IT
- RESEARCH UNIVERSITY INSTITUTE OF COMMUNICATION AND COMPUTER SYSTEMS3 projects · EL
- ICFO-CERCA3 projects · ES
- III-V LAB3 projects · FR
- MELLANOX3 projects · IL
Projects
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| Project | Programme | EU contribution | Total cost | |
|---|---|---|---|---|
IMaging-based CUSTOMised EYE diagnostics IMCUSTOMEYE · 779960 | H2020 | €5,931,669 | €108,535 | Details |
Photonic technologies for progrAmmable transmission and switching modular systems based on Scalable Spectrum/space aggregation for future agIle high capacity metrO Networks PASSION · 780326 | H2020 | €7,535,748 | €517,188 | Details |
mid infraREd Fully Integrated CHemical sensors REDFINCH · 780240 | H2020 | €3,993,211 | €177,821 | Details |
Mid-infrared arthroscopy innovative imaging system for real-time clinical in depth examination and diagnosis of degenerative joint diseases MIRACLE · 780598 | H2020 | €6,133,636 | €503,500 | Details |
High Performance and High Yield Heterogeneous III-V/Si Photonic Integrated Circuits using a Thin and Uniform Bonding Layer PICTURE · 780930 | H2020 | €3,924,533 | €325,145 | Details |
Next generation X-ray imaging system NEXIS · 780026 | H2020 | €7,712,153 | €769,250 | Details |
Multi-modal, multi-scale retinal imaging MERLIN · 780989 | H2020 | €4,867,660 | €1,072,825 | Details |
3D Photonic integration platform based on multilayer PolyBoard and TriPleX technology for optical switching and remote sensing and ranging applications 3PEAT · 780502 | H2020 | €3,993,285 | €484,375 | Details |
Micro Quantum Dot-Light Emitting Diode and Organic Light Emitting Diode Direct Patterning (MILEDI) MiLEDI · 779373 | H2020 | €4,130,041 | €454,413 | Details |
Wafer-scale, CMOS integration of photonics, plasmonics and electronics devices for mass manufacturing 200Gb/s non-return-to-zero (NRZ) transceivers towards low-cost Terabit connectivity in Data Centers plaCMOS · 780997 | H2020 | €4,036,378 | €374,375 | Details |