CORDIS Project
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The PICTURE project aims to advance photonic integration technology by bonding different semiconductor materials to silicon wafers. This will enhance the performance of lasers and detectors, leading to cost-effective photonic integrated circuits for high-speed communication.
The objective of PICTURE project is to develop a photonic integration technology by bonding multi-III-V-dies of different epitaxial stacks to SOI wafers with a thinner and uniform dielectric bonding layer.
This heterogeneous integration platform will enable higher performance lasers and photo-detectors using the optimized III-V dies.
In addition, the thinner bonding layer will lead to record performance MOSCAP III-V/Si modulators, and to a new generation of wavelength tunable distributed feedbac…
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United Kingdom, Southampton
Type: University / higher education
Activity type: Higher or Secondary Education Establishments
SME: No
United Kingdom, London
Type: University / higher education
Activity type: Higher or Secondary Education Establishments
SME: No
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