Topic

ICT-2013.3.1

ICT-2013.3.1

10 projects · €34,553,149 total EU contribution (project-level) · 79 participating organizations · 17 countries with participants

Total EU funding

Sum of EC max contribution fields for distinct projects in this topic.

€34,553,149

Countries active

Participant organizations by country (headquarters in CORDIS).

Open calls

From the EU Funding & Tenders Portal, linked to this topic code when it matches the call identifier. Sync via yarn etl:funding.

No open or forthcoming calls linked to this topic in the database yet.

Top organizations

By number of distinct projects in this topic.

Projects

Page 1 of 1

ProjectEU contribution

Energy Efficient Tunnel FET Switches and Circuits

E2SWITCH · 619509

€4,374,000
Details

Compound Semiconductors for 3D integration

COMPOSE3 · 619325

€3,195,303
Details

Automotive Tested High Voltage and Embedded Non-Volatile Integrated System on Chip platformemploying 3D Integration

ATHENIS_3D · 619246

€6,000,000
Details

Computational Lithography for Directed Self-Assembly: Materials, Models and Processes

CoLiSA.MMP · 619793

€3,546,000
Details

Modelling Reliability under Variability

MoRV · 619234

€3,058,000
Details

Board and SoC Test Instrumentation for Ageing and No Failure Found

BASTION · 619871

€3,442,000
Details

Modular interposer architecture providing scalable heat removal, power delivery, and communication

CarrICool · 619488

€4,042,847
Details

Nanoelectronic COupled Problems Solutions

nanoCOPS · 619166

€3,499,000
Details

Technology CAD for III-V Semiconductor-based MOSFETs

III-V-MOS · 619326

€2,900,000
Details

Support Action for 450mm topics establishing a Bridge between European EM entities and IDMs, Foundries and Entities Worldwide

Bridge450 · 619833

€495,999
Details