CORDIS Project
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COMPOSE3 aims to create advanced three-dimensional stacked circuits using high mobility materials to improve the efficiency and density of semiconductor devices. The project focuses on integrating these technologies into existing manufacturing processes.
COMPOSE3 aims to develop 3D stacked circuits in the front end of line of Complementary Metal Oxide Semiconductor (CMOS) technology, based on high mobility channel materials.
The final objective is a 3D stacked SRAM cell, designed with gates length taken from the 14nm technology node.
This technology will provide a new paradigm shift in density scaling combined with a dramatic increase in the power efficiency of CMOS circuits.
Our synergistic approach is based on the use of high mobility channel…
IBM RESEARCH GMBH
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Germany, DRESDEN OT WEIXDORF
Type: Company (for-profit)
Activity type: Private for-profit entities (excluding Higher or Secondary Education Establishments)
France, Crolles
Type: Company (for-profit)
Activity type: Private for-profit entities (excluding Higher or Secondary Education Establishments)
SME: No
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