CORDIS Project
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This project proposes a novel approach to integrated circuits by combining ultra-low power design with three-dimensional integration. This aims to enhance performance while addressing thermal dissipation issues, leading to more efficient electronic devices.
The current integrated circuit scaling hits two major roadblocks or walls.
One wall is the atomic level feature sizes of the current devices forcing the capabilities of even nano-scale implementations.
The other wall is the total power consumed per unit area exceeding the capabilities thermal dissipation techniques limiting the maximum device densities.
The solution to the feature size problem is scaling in the orthogonal direction to the conventional device plane - the 3D integration.
The solut…
SABANCI UNIVERSITESI
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