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The TMGSiP project aims to create a compact 120GHz radio front-end for high-speed wireless communication, utilizing advanced silicon technology. It focuses on developing integrated components that enhance performance, reduce size, and lower power consumption for data transmission rates up to 40Gbps over short distances…
The goal of ""THz Muti-Gb/s System in Package"", i.e., ""TMGSiP"" project is to develop a fully integrated 120GHz radio front-end for Multi-Gb/s radio links with state-of-the-art SiGe BiCMOS technology.
This will be done with a completely new cross-cutting design methodology for silicon-MMIC, e.g. the development of wideband receiver and transmitter, including on-chip antenna and novel packaging concepts.
This will enable a big improvement in the functionality (complexity of RF MMICs), performan…
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