CORDIS Project
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The TIPS project focuses on developing advanced embedding technologies for electronic components, enabling the creation of ultra-thin, stacked packages. By testing individual packages before stacking, the project aims to improve yield rates and ensure reliability for applications, particularly in the medical field.
The project TIPS aims at the conflation of embedding technologies for electronic components into extremely thin packages and the interconnection of those packages into stacked electronic systems.
The testing of individual packages before stacking is performed will mitigate stacked package yield issues.Embedding of components will be developed starting from a basis of different technical approaches, depending on component type (active or passive), dimension and commercial availability.
In order t…
Partner organizations (coordinator is shown above), with normalized type and CORDIS activity type. Guests see up to 4 partners.
Switzerland, LENZBURG
Type: Company (for-profit)
Activity type: Private for-profit entities (excluding Higher or Secondary Education Establishments)
Germany, Berlin
Type: University / higher education
Activity type: Higher or Secondary Education Establishments
SME: No
Germany, ROT AM SEE
Type: Company (for-profit)
Activity type: Private for-profit entities (excluding Higher or Secondary Education Establishments)
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