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TECTONIC aims to address thermal management in 3D stacked chip-multiprocessors by integrating software and hardware solutions. It focuses on using emerging non-volatile memory technologies to improve heat distribution and enhance performance.
The goal of the TECTONIC project is to alleviate the challenging problem of hot-spots in 3D stacked chip-multiprocessors by employing a software-hardware based combined approach.
With the stagnation in process technology scaling new emerging memory technologies are investigated.
Promise of better scalability with reduced static leakage makes Non-volatile memories (NVM) as the potential candidates to replace conventional SRAM.
However, many of the proposed NVM technologies are sensitive to heat,…
NORGES TEKNISK-NATURVITENSKAPELIGE UNIVERSITET NTNU
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