CORDIS Project
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This project aims to improve the current carrying capability of semiconductor probe cards by developing accurate models to predict probe burn phenomena. It focuses on enhancing probe design to prevent failures during wafer testing.
As the probe size shrinks due to finer device pitches, its current carrying capability (CCC) is also reduced, conflicting with the future wafer test requirements for power delivery.
Probe burn can result in damage to probe-card or pad of wafer tested, causing significant semiconductor wafer yield loss.
The approach in the test industry has been mostly experimental for baseline data for determining this key parameter-CCC of probes on probe cards.
Often, the CCC of a probe calculated empirically,…
ISTANBUL SEHIR UNIVERSITESI
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