CORDIS Project
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NanoDrip is a novel printing technology for advanced semiconductor packaging, enabling ultra-high-resolution microfabrication in just two steps. It addresses the challenges of current methods by allowing greater design flexibility and reducing environmental impact, thereby supporting the production of next-generation e…
The ongoing global trend of miniaturization is driven by the demand for a huge range of high-end devices such as smartphones, automotive connectivity and IoT/AI applications.
This is highly dependent on the fabrication of embedded Integrated Circuits on semiconductor wafers & the advanced semiconductor packaging processes that protect ICs while providing connectivity to printed circuit boards & adjacent ICs.
The fabrication of redistribution layers (RDL), is particularly challenging and expensiv…
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