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MAGALIGN aims to develop a novel magnetic alignment method for 3D integration in microelectronics, enhancing the accuracy of wafer bonding. This approach could significantly improve interconnect density and data transfer capabilities in advanced chip designs.
In microelectronics, 3D integration and assembly definitely appears as a very efficient option to achieve highly integrated chips.
It offers major benefits such as combining heterogeneous technologies, combining high-performance and low-power chips, increasing data transfer bandwidth in memory above logic circuits, etc. 3D assembly is realized by bonding two wafers or chips face to face on a wafer.
In this bonding process, the number of interchips interconnects is limited by the accuracy of the…
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