CORDIS Project
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The io600 system revolutionizes semiconductor packaging by utilizing Continuous Laser-Assisted Deposition technology for efficient material deposition. It enhances resolution and throughput while minimizing environmental impact, enabling the production of smaller, more powerful chips for electronic equipment manufactur…
The semiconductor industry is aiming at producing smaller and more powerful chips.
However, semiconductor packaging (back-end) technologies have reached their limits in terms of material deposition.
Backend solutions for material deposition are 1) Subtractive technologies - etching and electroplating - highly polluting and, thus, unsustainable: and 2) Additive Manufacturing techniques that have reached their resolution limit considering the material fillers and/or viscosity, making it impossibl…
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