CORDIS Project
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The HERMES project focuses on developing a new packaging technology for electronic circuits that integrates components directly into printed circuit boards. This approach aims to enhance functionality, reduce costs, and shorten production times for electronic devices.
The proposed HERMES project wants to initiate a new mainstream packaging concept not bound by the existing supply chain, and by large-scale manufacturing technology.
The project is aiming at further developing the concept of embedded thin chips into electronic boards, as a base for an integrated manufacturing of electronic circuits.<br/>The project consortium will develop a technology for embedding active and passive components, allowing more functional integration and higher density.
The techno…
AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
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Belgium, Oostkamp
Type: SME
Activity type: Private for-profit entities (excluding Higher or Secondary Education Establishments)
SME: Yes
Germany, Neubiberg
Type: Company (for-profit)
Activity type: Private for-profit entities (excluding Higher or Secondary Education Establishments)
SME: No
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