CORDIS Project
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This project focuses on improving heat pipe technology for electronic devices by developing a new manufacturing process for carbon nanotube-copper composite foams. The goal is to enhance cooling efficiency for modern processors.
Modern electronic devices have flourished because of the relentless development of new lithographic processes that result in ever higher and more compact computing power.
However, this increases the amount of heat generated in a decreasing volume.
As a result the computing power of many modern processors is truncated to avoid thermal damage.The preferred cooling technology for portable electronic devices are heat pipes.
While this technology allows for impressive cooling performances, heat pipes…
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