CORDIS Project
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This project develops a design flow for three-dimensional integrated circuits (ICs) to enhance performance in high-end processors. It focuses on addressing variability in hybrid-bonding technology, utilizing machine learning for optimization and ensuring reliability in semiconductor applications.
As the device size is shrunk to its quantum limit, Moore’s law is becoming more difficult to follow.
By exploiting the z-direction in the gate, block or system level, three-dimensional (3D) integrated circuit (IC) technology has the potential to extend Moore’s law.
Face-to-face wafer by wafer Hybrid-bonding (H-b) based 3D System-On-Chip (H-3D-SOC) is one of the most promising 3D IC solutions.
However, an exclusive IC design flow for H-3D-SOC for high-end processor with parameters of H-b pads fro…
INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM
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