CORDIS Project
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This project focuses on reducing packaging costs in microelectronics through innovative microwave bonding technology. It aims to enhance manufacturing efficiency and quality, providing European companies with a competitive edge in the global market.
The cost of packaging in microelectronics is around 30% of total production costs, but this is rising at an alarming rate due to the increasing consumer demand for smaller and smarter portable electronic devices.
In micro-systems, the costs of packaging can be up to 80% of total production costs.
Technological advances to reduce packaging costs are therefore of pivotal importance to maintain the competitive edge of assembly companies.
Moreover, with the exodus of high volume packaging and assemb…
FRAUNHOFER GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG EV
Partner organizations (coordinator is shown above), with normalized type and CORDIS activity type. Guests see up to 4 partners.
Germany, St. Georgen
Type: Company (for-profit)
Activity type: Private for-profit entities (excluding Higher or Secondary Education Establishments)
CAMERA DI COMMERCIO, INDUSTRIA, ARTIGIANATO E AGRICOLTURA DI MILANO
Italy, MILANO
Type: Public body
Activity type: Public bodies (excluding Research Organisations and Secondary or Higher Education Establishments)
SME: No
United Kingdom, Livingstone, Kirkton North, West Lothien
Type: Company (for-profit)
Activity type: Private for-profit entities (excluding Higher or Secondary Education Establishments)
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