CORDIS Project
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This project addresses challenges in integrated photonics by analyzing defects in III-V materials and developing thermal management strategies for photonic devices on silicon. It aims to enhance device reliability and performance.
Photonic integrated circuits (PIC) are becoming a key contender for the next generation of communication.
Two main barriers exist for the seamless integration of electronics and photonics, the integration of active photonic components on the silicon chip, and their downsizing towards electronic dimensions. III-Vs with their tunable direct bandgaps are the materials of choice for integrated lasers on Si. IBM has achieved room-temperature III-V optically pumped microdisk lasers monolithically on S…
IBM RESEARCH GMBH
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