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This project addresses challenges in semiconductor interconnects by exploring alternative materials, specifically nickel-aluminium alloys, for microchip fabrication. It focuses on preventing surface oxidation and improving performance at sub-10 nm scales through innovative cleaning and passivation techniques.
Interconnects impose major limits on the performance on integrated circuits during the exponential reduction of feature size of microchips.
The semiconductor industry faces challenges in the metallization of interconnects below the 10 nm half pitch and is looking to alternative metallization schemes to replace copper, the traditional choice for the last 20 years, which no longer meet the conductivity requirements at decreasing length scales.
Binary metals such as nickel-aluminium (NiAl) have bee…
INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM
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