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SEMRON is creating a compact 3D AI inference chip designed to run large language models efficiently on edge devices. Utilizing a novel capacitive technology, this chip aims to overcome current limitations in size and power consumption, enabling advanced AI capabilities without overheating.
Large Language Models (LLMs) are at the center of the roadmaps of almost all large tech companies for new features in electronic devices.
However, they usually consists of billions of parameter and running them outside the cloud in edge devices limits the chip size often to less than a square centimetre of silicon and less than 1 W continuous power consumption amongst other criteria.
Current technologies not just fail to provide these technical features but also lack of the potential to meet the…
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