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The BOOM project focuses on advancing Silicon-on-Insulator integration technology to create compact and efficient silicon photonic components. These components aim to enhance high-speed broadband core networks by integrating III-V materials with silicon for improved performance and reduced costs.
BOOM is an integration project that aims to pursue the systematic advancement of Silicon-on-Insulator (SOI) integration technology to develop compact, cost-effective and power efficient silicon photonic components that enable photonic Tb/s capacity systems for current and new generation high speed broadband core networks.
BOOM develops fabrication techniques as well as flip-chip bonding and wafer-scale integration methods to fabricate and mount the complete family of III-V components on SOI boar…
RESEARCH UNIVERSITY INSTITUTE OF COMMUNICATION AND COMPUTER SYSTEMS
EREVNITIKO PANEPISTIMIAKO INSTITOUTO SYSTIMATON EPIKOINONION KAI YPOLOGISTON
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LEIBNIZ-INSTITUT FUR INNOVATIVE MIKROELEKTRONIK
Germany, Frankfurt Oder
Type: Research institute
Activity type: Research Organisations
SME: No
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